Numerical Evaluation for Measurement Conditions of Interfacial Tension between Molten Slag and Molten Iron by Oscillating Drop Technique in ISS

DOI:10.15011//jasma.36.360207
Int. J. Microgravity Sci. Appl. 2019p360207
Author
E. SHOJI, R. TAKAHASHI, N. ITO, M. KUBO, T. TSUKADA and M. WATANABE
Organization
Department of Chemical Engineering, Tohoku University, Department of Physics, Gakushuin University
Abstract
Measurement of interfacial tension between molten slag and molten iron under microgravity in the International Space Station (ISS) is planned. An oscillating drop technique, in which interfacial tension is determined from the oscillation frequency of a levitated compound droplet, with an electrostatic levitator is going to be used in the interfacial tension measurement. In our previous work, a numerical model to simulate the oscillation behavior of a compound droplet was developed, and the effects of viscosity and radius ratios of shell to core phases in the droplet on the oscillation frequencies were investigated. However, the previous study used assumed values as physical properties of samples because of the insufficient data. In addition, the effect of temperature, which is one of the experimental conditions, was not investigated. Therefore, the objective of this work is to present proper experimental conditions in the ISS including the temperature and the radius ratio by numerical simulation with actually measured properties of samples. The first conclusion of this work is that the appropriate radius ratio is 1.2–1.4 depending on the experimental conditions. The second one is that all the measured interfacial tensions show low relative errors less than 10%, although the interfacial tension cannot be obtained under comparatively lower temperature, i.e., for higher viscous molten slag.
Keyword(s)
Interfacial tension, Oscillating drop technique, Numerical simulation, Compound droplet, Microgravity
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Received 21 December 2018, Accepted 10 April 2019, Published 30 April 2019

© The Japan Society of Microgravity Applicaiton

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